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Molex 6 Pin Micro Fit Serial Interface Cable
Molex 6-Pin Micro-Fit Serial Interface Cable
Molex Micro-Fit 3.0 Connector
Molex Micro-Fit 3.0 Series Wiring Harness 6 Circuits
Molex Micro-fit 3.0 43025-0600 43025 6 Pin Overmolded Cable Assembly Wire Harness
Micro Fit 3.0 6 pin 2*3 pin molded to stripped tinned end pigtail cable
Micro-Fit 3.0 Interconnect System
Molex's unique Micro-Fit 3.0 interconnect system offers up to 8.5 A with a 3.00 mm pitch
Image of Molex's Micro-Fit 3.0™ Interconnect SystemMolex's Micro-Fit 3.0 offers up to 8.5 A with a 3.00 mm pitch, delivering power in a compact package in wire-to-wire and wire-to-board configurations. OEMs often need power connectors in space-constrained applications. Micro-Fit 3.0 blind-mate interface (BMI) connectors are designed for blind-mating applications. They allow mating misalignment. In hard-to-reach applications, such as drawers or fan assembly trays, connectors need to be mated and unmated without being seen. Doing so can cause damage to the connector and/or terminal and consume valuable labor time. The Micro-Fit TPA connector family helps prevent failure in end products by offering terminal position assurance (TPA). The TPA reduces terminal back-out by providing locking redundancy, assemblers cannot insert the TPA unless the terminal is properly inserted.
Micro-Fit 3.0 CPI (compliant pin) connectors provide a compliant pin interface while maintaining all the features of the standard Micro-Fit 3.0 connector. The robust eye-of-the-needle design provides a reliable interface when recommended board layouts are followed. The Micro-Fit 3.0 CPI header mates with Micro-Fit 3.0 receptacle, allowing running changes as boards transition from solder to press-fit applications. For lower applied costs, OEMs often prefer a compliant pin connector over one that requires soldering.
Micro-Fit 3.0 RMF (reduced mating force) terminals are designed for applications needing lower engagement and disengagement forces or when the units are cycled frequently. The pre-lubricated version can be mated up to 250 times and fit into standard Micro-Fit 3.0 housings. Applications often require rugged terminals and lower mating force to reduce operator fatigue during assembly and/or to withstand high-mating cycles.
The Micro-Fit 3.0 is a unique interconnect system designed to meet the need for a high contact density signal or power connector and incorporates many of the features previously found on larger power connectors. Micro-Fit products are available in circuit sizes 2 to 24 for single- and dual-row, wire-to-board, and wire-to-wire applications. The product family has over 500 part numbers with many retention choices including fitting nails, solderable clips, and offset terminal retention. Low force lubricated terminals are designed for ease of mating and un-mating. The Micro-Fit 3.0 connector system offers features such as terminal position assurance, blind-mating and polarization for easy, accurate assembly.